PIC Process RD Engineer

Job Brief:

Are you passionate about pushing the boundaries of photonic integrated circuit (PIC) technology

Our client is seeking a skilled PIC Process R&D Engineer to lead the development of new processes and modules for our innovative thinfilm lithium niobate (TFLN) platform. This role offers a unique opportunity to contribute to the next generation of photonics solutions while collaborating with top academic institutions.

As a PIC Process R&D Engineer you will be responsible for developing and optimizing new process modules that advance our TFLNbased PIC platforms. Your work will be critical in continuing innovation at the process level within stateoftheart cleanroom environments turning cuttingedge photonic technologies from concept into reality.

Responsibilities:

• Process Development: Design develop and implement innovative process modules for TFLN

  based PICs collaborating with stateoftheart R&D and production cleanrooms.

• Experimental Work: Conduct experiments and process trials in cleanroom environments analyzing data to optimize and validate new processes.

• Collaboration: Work closely with R&D teams from design to optical testing and characterization contributing to crossfunctional projects to advance our PIC technologies.

• Documentation and Reporting: Maintain thorough documentation of process development and report findings. Implement process control methods such as 6Sigma and Cpk for yield optimization and process qualification.

• Process Integration: Assist in integrating new processes into production workflows ensuring they meet the highest quality and reliability standards.

• Innovation: Stay current on the latest advancements in photonics incorporating new techniques and technologies into process development.

Skills Required:

• Educational Background: An advanced degree (Masters or PhD) in Photonics Electrical

  Engineering Materials Science or a related field.

• Experience: At least 3 years of experience in integrated photonics process development TFLN silicon or SiN photonics or related platforms. Experience with 6Sigma and Cp/Cpk methodologies is a strong plus.

• Technical Skills: Proficiency in microfabrication techniques such as ebeam lithography UV/DUV stepper lithography contact mask lithography DLW plasma etching (ICP RIE IBE etc.) wet etching thinfilm deposition (CVD LPCVD PECVD Sputtering etc.) and metallization.

• ProblemSolving: Strong analytical skills and a creative approach to solving complex technical challenges.

• Collaboration: Excellent communication skills and the ability to work effectively in a multidisciplinary team.

• Adaptability: The ability to thrive in a fastpaced startup environment demonstrating flexibility and resilience in the face of change.

• Language Skills: Fluency in English is required; knowledge of German or French is an advantage.