DFM Engineer

DfM Job Description (India) Subject Matter Expert (PCB & PCBA Mfg)

We require engineers to develop the nextgeneration technologies that change how users connect explore and interact with information and one another. As a member of an extraordinarily creative motivated and talented team you develop new products that are used by millions of people. We need our engineers to be versatile and passionate to tackle new problems as we continue to push technology forward. If you get excited about building new things and arent daunted by the challenge of building something from scratch then our team might be your next career step.

Our mission is to organize the worlds information and make it universally accessible and useful. Only one thing consistently stands in the way between our users and the worlds information hardware. Our Devices & Services team researches designs and develops new technologies and hardware to make our users interaction with computing faster more powerful and seamless. Whether finding new ways to capture and sense the world around us advancing form factors or improving interaction methods our team is making peoples lives better through technology.

As a DfM Engineer (Printed Circuit Board / Printed Circuit Board Assembly) you will work on the commercialization of products. You will be the cornerstone of all Printed Circuit Board Assembly activities and will work with technical crossfunctional teams in the development of new products.

The position requires a strong technical aptitude including an excellent understanding of DfM methodologies high volume electronics manufacturing processes printed circuit board technology component selection test and inspection methodologies quality assurance and consumer electronics product development.

Responsibilities:

• Perform Design for Manufacturability (DfM) analysis and deliver scalable manufacturing solutions for PCBAs.

• Support NPI builds from DVT to product launch including build preparation build reports and issue resolution at contract manufacturers.

• Support released products until EOL overseeing process yield control & cost reduction activities.

• Identify and drive DfM and process improvements that reduce process cycle times and costs while maintaining exceptional quality.

• Develop new processes to achieve miniaturization.

• Onsite support during development and sustaining builds.

• Good communication skills to internal and crossfunctional teams.

Minimum Qualifications:

• BS in Electrical Engineering Industrial Engineering Manufacturing Engineering or equivalent practical experience.

• 3 years of relevant work experience with consumer or communication products with a strong background in PCBA manufacturing and handson process experience.

• Technologist with an extremely high level of creativity and curiosity about materials science and electronics packaging at all levels.

• Experience in rework & underfill.

Preferred Qualifications:

• Advanced materials underfills thermal interface materials RF shielding.

• Knowledge of typical PCBA and product level failure modes and ability to relate failure modes to process material and design related stressors.

Remote Work :

No